-
型号
厂家
封装
批号
数量
询价
-
30H80049
HTC
BGA48
2023+
3875
询价
-
3002942-0001
HUGHES
SOP20
2023+
3827
询价
-
3050-24P-0.5MSEP
HYUPJIN
IOCONNEC
2023+
3565
询价
-
32R7216ESDPQ
IBM
BGA
2023+
3827
询价
-
39MPEGCD21PFE18C
IBM
QFP
2023+
3827
询价
-
32R6475 ESD PQ
IBM
BGA
2023+
3550
询价
-
32R6476 ESD PQ
IBM
BGA
2023+
3550
询价
-
343S0295
IBM
BGA
2023+
3550
询价
-
343S0298 U3-H
IBM
BGA
2023+
3550
询价
-
343S0321
IBM
BGA
2023+
3550
询价
